3D-MID (Molded Interconnect Devices)

3D-MID allows for the integration of mechanical and electrical functions in the molded part.

Main characteristics:

  • three dimensional molded printed circuit boards as replacement of regular PCBs (shielding or transmitting elements)
  • many design options
  • suitable material: PES, PEI, LCP, PA46, PA66

Different production processes can be utilized:

  • two-component molding with metalizing
  • hot stamping of electrical-conductive films
  • back molding of films that carry the PCBs
  • insert molding of pre-formed metal structures